Free shaping of packaging: Is that possible? Study on the potentials and chances of laser-based thermoforming

To meet the complex requirements of flexible production technology and packaging processes, a technological leap is necessary, realized at the Fraunhofer IGCV within the »LaserForming« Study framework. Especially form-bound process steps such as sealing and forming currently do not meet these requirements. At this point, laser technology offers new possibilities to meet the current trend towards individualization and, for example, to ensure the flexible production of different products.

 

Laser technology offers the advantages of free contour control and power and contactless energy transmission. These advantages of the laser beam have already enabled new, highly flexible production technologies (e.g., selective laser melting or laser beam welding). In packaging technology, laser-based thermoforming is also used to achieve material savings through informal, incremental heating and forming of the film and thus the targeted influence on wall thicknesses.

The Fraunhofer IGCV has already produced the first sample products using laser-based thermoforming so that the transferability of this technology to industry requirements can now be tested. Also, a technical and economic evaluation of the potential of laser technology in packaging technology was carried out, which was realized by the following solution modules:

  • Analysis Systematization: Which geometric elements are required by conventional packaging (radii of webs etc.)?
  • Experimental investigations: What parameters and what duration is needed to produce these molds?
  • Potential assessment and recommendations for action: How high is the technical potential? What economic potential does the process offer?

To meet current market requirements, the contours and geometries produced correspond to the packaging currently available on the market. Thus, the study mainly considered packaging made by member companies of the Industrievereinigung für Lebensmitteltechnologie und Verpackung e.V. (IVLV).

Laser-based thermoforming Fraunhofer IGCV
© Fraunhofer IGCV / Bernd Müller
Laser-based thermoforming

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